Our Services

At Semi Dice Pvt. Ltd., we offer a wide range of semiconductor solutions tailored to meet the unique demands of industries worldwide. Our services are designed to provide end-to-end support, from initial design to production and delivery, ensuring precision, reliability, and innovation at every step.

ASIC Design and Fabrication

We specialize in delivering Application-Specific Integrated Circuit (ASIC) solutions customized to your specific requirements.

  • Technologies Supported: Bipolar, CMOS, Mixed Signal, GaAs, and GaN.
  • Comprehensive Process: From architecture selection and schematic design to simulation and GDS file generation.
  • Global Collaborations: Partnering with leading fabs like Tower Semiconductor (Israel), X-FAB (Germany), and WIN Semiconductor (Taiwan).
  • Turnkey Solutions: A single point of contact for all design and fabrication needs, ensuring seamless execution.

Supply of Wafers and Bare Dies

We provide high-quality wafers and bare dies to support a variety of applications, including Hybrid Micro Circuits (HMC) and Chip-On-Board (COB) technologies.

  • Product Range: Voltage Regulators, SMPS Controller ICs, Operational Amplifiers, and other mixed-signal ICs.
  • Flexible Quantities: No MOQ restrictions, catering to small-scale and custom requirements.
  • Quality Assurance: Controlled storage conditions for extended durability and reliability.

Packaged Semiconductor Devices

To address growing demands in critical industries, we offer packaged semiconductor devices manufactured to the highest standards.

  • Packages Available: SO packages and TO220 power devices.
  • Industry Applications: Electric vehicles (EVs), solar inverters, and chargers.
  • Future Expansion: Plans to introduce high-power press pack Thyristors, Diodes, and IGBTs for railways and EVs.

Drop-in Replacements for Obsolete Parts

We provide exact replacements for discontinued or hard-to-find semiconductor components, helping clients avoid costly redesigns.

  • Devices Covered: Discrete semiconductors, Bipolar and CMOS Mixed Signal ICs, Analog-to-Digital Converters, Digital-to-Analog Converters, and Logic Gates.
  • Customized Solutions: Designed to meet the specific needs of legacy systems and high-volume requirements.
  • Cost Efficiency: Reduces downtime and eliminates the need for new PCB designs.